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首页> 外文期刊>The journal of physical chemistry, A. Molecules, spectroscopy, kinetics, environment, & general theory >Studies of Carbon Incorporation on the Diamond{100}Surface during Chemical Vapor Deposition using Density Functional Theory
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Studies of Carbon Incorporation on the Diamond{100}Surface during Chemical Vapor Deposition using Density Functional Theory

机译:密度泛函理论研究化学气相沉积过程中金刚石{100}表面碳的掺入

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Accurate potential energy surface calculations are presented for many of the key steps involved in diamond chemical vapor deposition on the{100}surface(in its 2X1 reconstructed and hydrogenated form).The growing diamond surface was described by using a large(~1500 atoms)cluster model,with the key atoms involved in chemical steps being described by using a quantum mechanical(QM,density functional theory,DFT)method and the bulk of the atoms being described by molecular mechanics(MM).The resulting hybrid QM/MM calculations are more systematic and/or at a higher level of theory than previous work on this growth process.The dominant process for carbon addition,in the form of methyl radicals,is predicted to be addition to a surface radical site,opening of the adjacent C-C dimer bond,insertion,and ultimate ring closure.Other steps such as insertion across the trough between rows of dimer bonds or addition to a neighboring dimer leading to formation of a reconstruction on the next layer may also contribute.Etching of carbon can also occur;the most likely mechanism involves loss of a two-carbon moiety in the form of ethene.The present higher-level calculations confirm that migration of inserted carbon along both dimer rows and chains should be relatively facile,with barriers of ~150 kJ mol~(-1)when starting from suitable diradical species,and that this step should play an important role in establishing growth of smooth surfaces.
机译:准确地计算了{100}表面(以2X1重构并氢化的形式)上金刚石化学气相沉积过程中涉及的许多关键步骤的势能表面计算。通过使用较大的(约1500个原子)描述了正在生长的金刚石表面。聚类模型,其中涉及化学步骤的关键原子通过使用量子力学(QM,密度泛函理论,DFT)方法描述,大部分原子通过分子力学(MM)描述。所得混合QM / MM计算比以前有关该生长过程的工作更系统化和/或处于更高的理论水平。预计以甲基自由基的形式进行碳添加的主要过程将添加到表面自由基部位,并打开相邻的CC二聚体键,插入和最终的闭环。其他步骤,例如在两聚体键行之间的槽中插入或添加到相邻的二聚体上,导致在下一层上形成重构碳的腐蚀也可能发生;最可能的机理涉及乙烯形式的二碳部分的损失。目前的更高水平的计算结果证实,插入的碳沿二聚体行和链的迁移应相对容易当从合适的双基物种开始时具有〜150 kJ mol〜(-1)的势垒,并且该步骤在建立光滑表面的生长中应该起重要作用。

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