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首页> 外文期刊>Polymer: The International Journal for the Science and Technology of Polymers >Positive-temperature-coefficient effect of electrical resistivity below melting point of poly(vinylidene fluoride) (PVDF) in Ni particle-dispersed PVDF composites
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Positive-temperature-coefficient effect of electrical resistivity below melting point of poly(vinylidene fluoride) (PVDF) in Ni particle-dispersed PVDF composites

机译:Ni颗粒分散的PVDF复合材料中低于聚偏氟乙烯(PVDF)熔点的电阻率的正温度系数效应

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摘要

This paper discusses the positive-temperature-coefficient effects of resistivity in Ni particle-dispersed poly(vinylidene fluoride) (PVDF) composites based on experiment results from SEM, DSC, and pressure-volume-temperature (PVT) measurements. The melting points of composites with Ni content of 20, 30, 40, and 50vol.% were equal to that of pure PVDF. The PTC effects in composites with Ni content of 40 and 50vol.% occurred at temperatures near the melting point of the PVDF matrix, whereas those in composites with Ni content of 20 and 30vol.% occurred at temperatures below the melting point of the PVDF matrix. We found that the PTC effect occurs even without melting of the matrix polymer. Moreover, we determined that a slight increase in specific volume at temperatures below the melting point of the matrix polymer acts fully as a driving force for forming a gap between fillers. This suggestion was backed up by theoretical analyses using percolation theory and a thermal-fluctuation- induced tunneling model.
机译:本文基于SEM,DSC和压力-体积-温度(PVT)测量的实验结果,讨论了Ni颗粒分散的聚偏二氟乙烯(PVDF)复合材料中电阻率的正温度系数效应。 Ni含量为20、30、40和50vol。%的复合材料的熔点与纯PVDF相同。 Ni含量为40和50vol。%的复合材料中的PTC效应发生在接近PVDF基体熔点的温度下,而Ni含量为20和30vol。%的复合材料中的PTC效应发生在PVDF基体的熔点以下的温度下。我们发现,即使不熔化基体聚合物,也会发生PTC效应。此外,我们确定在低于基质聚合物熔点的温度下比容的轻微增加完全充当了形成填料之间间隙的驱动力。该建议得到了使用渗流理论和热波动诱导隧穿模型的理论分析的支持。

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