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首页> 外文期刊>Physical Review, B. Condensed Matter >Tight-binding molecular dynamics study of vacancy-interstitial annihilation in silicon - art. no. 205205
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Tight-binding molecular dynamics study of vacancy-interstitial annihilation in silicon - art. no. 205205

机译:硅中空位间隙an没的紧密结合分子动力学研究-艺术。没有。 205205

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We have studied the annihilation of a tetrahedral interstitial by a vacancy using molecular dynamics and a tight-binding model due to Goodwin-Skinner-Pettifor. At both 1473 and 1173 K, the annihilation process was dominated by the movement of the faster-diffusing vacancy. Once the vacancy moved to a nearest-neighbor position relative to the interstitial, annihilation was inevitable. As the initial distance between the T-interstitial and the vacancy increased, the number of pathways by which annihilation occurs increased accordingly. Fast and slow annihilation pathways were identified. The process was found to be highly stochastic in nature, requiring multiple simulations to provide adequate statistics. System size was not a factor in altering the results. The capture radius, within which annihilation is assured, was found to be between 5-6 Angstrom at 1473 K, although it is clear from the orientation dependence of the results that a spherically symmetric view of the capture radius is somewhat inappropriate. Limited investigation of annihilation between a (110) split interstitial and a vacancy confirmed the basic results of Tang el al. (Ref. 21) (using a Kwon tight-binding model) that the formation of a double-vacancy: double-interstitial configuration, dubbed a "bond-defect" by those authors, occurs in some but not all cases as part of the annihilation mechanism. [References: 28]
机译:我们已经研究了由于Goodwin-Skinner-Pettifor产生的空位,利用分子动力学和紧密结合模型消除了四面体间隙。在1473和1173 K处,an灭过程主要由快速扩散的空位的运动决定。一旦空缺移动到相对于间隙的最近邻居,an灭是不可避免的。随着T间隙和空位之间的初始距离增加,发生an灭的途径数量也相应增加。确定了快速和缓慢的an灭途径。发现该过程本质上是高度随机的,需要多次模拟才能提供足够的统计数据。系统大小不是改变结果的因素。尽管从结果的方向依赖性可以清楚地看出,捕获半径的球形对称视图在某种程度上是不合适的,但在确保半径的情况下,捕获半径在1473 K时介于5-6埃之间。对(110)裂隙和空位之间的ation灭进行了有限的研究,证实了Tang等人的基本结果。 (参考文献21)(使用权紧密结合模型),这些作者在某些情况下(但并非在所有情况下)形成了双空位:双间隙结构,被这些作者称为“粘结缺陷”。歼灭机制。 [参考:28]

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