...
首页> 外文期刊>Physica, B. Condensed Matter >Preparation and physical properties of Cu _xWO _3
【24h】

Preparation and physical properties of Cu _xWO _3

机译:Cu _xWO _3的制备及物理性质

获取原文
获取原文并翻译 | 示例

摘要

We report on the study of WO _3 doped with Cu using solgel (Cu _xWO _3 ~d) and impregnation (Cu _xWO _3 ~i) methods. All materials are well crystallized and exhibit single phases whose crystallite size ranges from 17 to 100 nm depending on Cu amount and the preparation technique. The conductivity dependence on temperature demonstrates semiconductor behavior and follows the Arrhenius model, with activation energies, E _σ, commonly in the range 0.40.6 eV. Moreover, the thermopower study shows that Cu _xWO _3 ~d is mainly of p-type conductivity, whereas Cu _xWO _3 ~i is n-type. The mechanism of conduction is attributed to a small polaron hopping. The doping process is found to decrease the interband transition down to 520 nm depending on the preparation conditions. The photoelectrochemical characterization confirms the conductivity type and demonstrates that the photocurrent J _(ph) increases with Cu-doping. Taking into consideration the activation energy, the flat band potential and the band gap energy, the band positions of each material are proposed according to the preparation method and Cu amount.
机译:我们报告了使用溶胶凝胶法(Cu _xWO _3〜d)和浸渍法(Cu _xWO _3〜i)掺杂铜的WO _3的研究。所有材料均能很好地结晶,并表现出单相,其微晶尺寸取决于Cu含量和制备技术,范围为17至100 nm。电导率对温度的依赖性证明了半导体的行为,并遵循Arrhenius模型,其激活能E_σ通常在0.40.6 eV的范围内。此外,热电研究表明,Cu _xWO _3〜d主要是p型电导率,而Cu _xWO _3〜i是n型。传导机制归因于小的极化子跳跃。已发现,根据制备条件,掺杂工艺可将带间跃迁降低至520 nm。光电化学特征证实了导电类型,并证明光电流J _(ph)随着Cu掺杂的增加而增加。考虑到活化能,平坦带电势和带隙能,根据制备方法和铜含量提出了每种材料的能带位置。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号