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Physical properties of copper oxide thin films prepared by dc reactive magnetron sputtering under different oxygen partial pressures

机译:直流反应磁控溅射在不同氧分压下制备的氧化铜薄膜的物理性能

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摘要

Nano-structured copper oxide thin films were deposited on glass substrates by dc reactive magnetron sputtering. The structural, morphological, electrical, and optical properties of the deposited copper oxide thin films were found to change with oxygen partial pressure. Changes in oxygen partial pressure during sputter deposition led to variations in Cu, Cu~+ and Cu~(+2) concentrations, which resulted in corresponding changes in the electronic characteristics of sputtered semiconducting copper oxide films from initially n- to p-type and then from p-type back to n-type. These phenomena demonstrate that p-type copper oxide thin films can only be deposited by dc reactive magnetron sputtering within a narrow oxygen partial pressure range.
机译:通过直流反应磁控溅射在玻璃基板上沉积纳米结构的氧化铜薄膜。发现沉积的氧化铜薄膜的结构,形态,电学和光学性质随氧分压而变化。溅射沉积过程中氧分压的变化导致Cu,Cu〜+和Cu〜(+2)浓度的变化,从而导致溅射的半导体氧化铜膜的电子特性从最初的n型转变为p型和相应的变化。然后从p型回到n型。这些现象表明,p型氧化铜薄膜只能在狭窄的氧气分压范围内通过直流反应磁控溅射沉积。

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