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首页> 外文期刊>Physica, B. Condensed Matter >Damage formation in Ge during Ar+ and He+ implantation at 15 K
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Damage formation in Ge during Ar+ and He+ implantation at 15 K

机译:15 K下Ar +和He +注入期间Ge中的损伤形成

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Ar+ and He+ ions were implanted into Ge samples with (100), (110), (111) and (112) orientations at 15 K with fluences ranging from 1 x 10(11) to 1 x 10(14) cm(-2) for the Ar+ ions and fluences ranging from 1 x 10(12) to 6 x 10(15) cm(-2) for the He+ ions. The Rutherford backscattering (RBS) technique in the channelling orientation was used to study the damage built-up in situ. Implantation and RBS measurements were performed without changing the target temperature. The samples were mounted on a four axis goniometer cooled by a close cycle He cryostat. The implantations were performed with the surface being tilt 7 degrees off the ion beam direction to prevent channelling effects. After each 300 keV Ar+ and 40 keV He+ implantation, RBS analysis was performed with 1.4 MeV He+ ions. For both the implantation ions, there is about no difference between the values found for the damage efficiency per ion for the four different orientations. This together with the high value (around 5 times higher than that found in Si), gives rise to the assumption of amorphous pocket formation per incident ion, i.e. direct impact amorphization, already at low implantation fluences. At higher fluences, when collision cascades overlap, there is a growth of the already amorphized regions.
机译:将Ar +和He +离子以15 K注入(100),(110),(111)和(112)取向的Ge样品中,注量范围为1 x 10(11)至1 x 10(14)cm(-2) )(对于Ar +离子)的能量密度在1 x 10(12)到6 x 10(15)cm(-2)的范围内。引导方向的卢瑟福反向散射(RBS)技术用于研究原位累积的损伤。在不改变目标温度的情况下进行植入和RBS测量。将样品安装在通过闭环He低温恒温器冷却的四轴测角仪上。进行注入时,表面应偏离离子束方向7度,以防止沟道效应。分别注入300 keV Ar +和40 keV He +后,用1.4 MeV He +离子进行RBS分析。对于两种注入离子,在四个不同方向上发现的每个离子的损伤效率值之间几乎没有差异。这与高值(比Si中的值高大约5倍)一起,导致了假设在每个注入离子处已经存在低注入通量的情况下,每个入射离子形成非晶袋,即直接冲击非晶化。在较高的注量下,当碰撞级联重叠时,已经非晶化的区域就会增加。

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