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Graphene-quantum-dot nonvolatile chargetrap flash memories

机译:石墨烯量子点非易失性电荷陷阱闪存

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摘要

Nonvolatile flash-memory capacitors containing graphene quantum dots (GQDs) of 6, 12, and 27 nm average sizes (d) between SiO_2 layers for use as charge traps have been prepared by sequential processes: ion-beam sputtering deposition (IBSD) of 10 nm SiO_2 on a p-type wafer, spin-coating of GQDs on the SiO_2 layer, and IBSD of 20 nm SiO_2 on the GQD layer. The presence of almost a single array of GQDs at a distance of ~ 13 nm from the SiO_2 /Si wafer interface is confirmed by transmission electron microscopy and photoluminescence. The memory window estimated by capacitance-voltage curves is proportional to d for sweep voltages wider than ± 3 V, and for d = 27 nm the GQD memories show a maximum memory window of 8 V at a sweep voltage of ± 10 V. The program and erase speeds are largest at d = 12 and 27 nm, respectively, and the endurance and data-retention properties are the best at d = 27 nm. These memory behaviors can be attributed to combined effects of edge state and quantum confinement.
机译:已通过连续工艺制备了在SiO_2层之间包含6、12和27 nm平均尺寸(d)的石墨烯量子点(GQD)用作电荷陷阱的非易失性闪存电容器,该工艺通过以下步骤进行:离子束溅射沉积(IBSD)为10在p型晶圆上涂覆SiO_2纳米SiO_2,在SiO_2层上旋涂GQD,在IBQ上将20nm SiO_2的IBSD涂覆。透射电子显微镜和光致发光证实了距SiO_2 / Si晶片界面约13 nm处几乎存在单个GQD阵列。对于大于±3 V的扫描电压,通过电容-电压曲线估算的存储器窗口与d成正比,对于d = 27 nm,GQD存储器在±10 V的扫描电压下显示最大存储器窗口为8V。擦除速度分别在d = 12 nm和27 nm时最大,而持久力和数据保留特性在d = 27 nm时最佳。这些记忆行为可归因于边缘状态和量子限制的组合作用。

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