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首页> 外文期刊>Nanotechnology >Nonvolatile floating gate memory containing AgInSbTe-SiO _2 nanocomposite layer and capping the HfO _2/SiO _2 composite blocking oxide layer
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Nonvolatile floating gate memory containing AgInSbTe-SiO _2 nanocomposite layer and capping the HfO _2/SiO _2 composite blocking oxide layer

机译:包含AgInSbTe-SiO _2纳米复合层并覆盖HfO _2 / SiO _2复合阻挡氧化物层的非易失性浮栅存储器

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摘要

An extremely large memory window shift of about 30.7V and high charge storage density=2.3×10 ~(13)cm ~2 at 23V gate voltage sweep were achieved in the nonvolatile floating gate memory (NFGM) device containing the AgInSbTe (AIST)SiO _2nanocomposite as the charge trap layer and HfO _2/SiO _2as the blocking oxide layer. Due to the deep trap sites formed by high-density AIST nanocrystals (NCs) in the nanocomposite matrix and the high-barrier-height feature of the composite blocking oxide layer, a good retention property of the device with a charge loss of about 16.1% at 15V gate voltage stress for 10 ~4s at the test temperature of 85°C was observed. In addition to inhibiting the Hf diffusion into the programming layer, incorporation of the SiO _2layer prepared by plasma-enhanced chemical vapor deposition in the sample provided a good Coulomb blockade effect and allowed significant charge storage in AIST NCs. Analytical results demonstrated the feasibility of an AIST-SiO _2nanocomposite layer in memory device fabrication with a simplified processing method and post-annealing at a comparatively low temperature of 400°C in comparison with previous NC-based NFGM studies.
机译:在包含AgInSbTe(AIST)SiO的非易失性浮栅存储(NFGM)器件中,在23V栅极电压扫描下实现了约30.7V的极大存储窗口移位和高电荷存储密度= 2.3×10〜(13)cm〜2 _2纳米复合材料作为电荷陷阱层,HfO _2 / SiO _2作为阻挡氧化物层。由于在纳米复合材料基质中由高密度AIST纳米晶体(NC)形成的深陷阱位点以及复合阻挡氧化物层的高势垒高度特征,因此该器件具有良好的保持性能,电荷损耗约为16.1%在15V的栅极电压下,在85°C的测试温度下观察到10〜4s的应力。除了抑制Hf扩散到编程层外,通过等离子体增强化学气相沉积法制备的SiO _2层在样品中的引入还提供了良好的库仑阻挡效应,并允许在AIST NC中大量存储电荷。分析结果表明,与以前基于NC的NFGM研究相比,AIST-SiO _2纳米复合材料层在存储器件制造中具有简化的加工方法和在400°C的较低温度下进行后退火的可行性。

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