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首页> 外文期刊>Electrochimica Acta >Modification of doping front migration in electrochemical devices and application to organic electronics
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Modification of doping front migration in electrochemical devices and application to organic electronics

机译:电化学装置中掺杂前迁移的修饰及其在有机电子中的应用

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摘要

We demonstrate several methods of modifying the doping front migration process in multilayer structures, enabling control of migration velocity and switching between different migration mechanisms. Sharp jumps in migration velocity may be induced using a delamination effect. The influence of migration layer thickness and composition is examined. Migration velocity may also be influenced by exposing the system to a defined relative humidity or by varying the concentration of a hygroscopic salt in the migration layer. The migration mechanisms can be explained in terms of diffusion, capillary transport, and delamination. By tailoring the migration process a variety of polymer electronic structures such as pseudo transistors (enhancement and depletion type) and electrical switches (ON-OFF and OFF-ON) may be fabricated. Further examinations about the doping front width are given and the phenomenon of a double front is described.
机译:我们展示了几种修改多层结构中掺杂前迁移过程的方法,可以控制迁移速度并在不同迁移机制之间进行切换。使用分层效应可能会引起迁移速度的急剧跳跃。检查迁移层厚度和组成的影响。迁移速度也可能受到影响,方法是将系统暴露在规定的相对湿度下,或者通过改变迁移层中吸湿盐的浓度来实现。可以用扩散,毛细运输和分层来解释迁移机理。通过调整迁移过程,可以制造各种聚合物电子结构,例如伪晶体管(增强和耗尽型)和电开关(开-关和关-开)。给出了关于掺杂前沿宽度的进一步研究,并描述了双前沿的现象。

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