Some Organic Compounds as Accelerator and Inhibitor for Electroplating Process

摘要

The electroplating of copper on copper and steel surface was studied in absence and in presence of 6(2, 4-dimethoxyphenyl)-2-oxo-1,2, ' 3,4-tetrahydropyrimidine-5-carbonitrile [Compound I] and calcium bis-[(R)-3-(2, 4-dihydroxy-3, 3-dimethylbutyramido) propionate] (D-calcium pantothenate) [compound II] by measuring the limiting current. It is found that, the rate of plating depends on the concentration of CuSO4, types of organic additives and its concentrations, viscosity, density and types of cathode. It is found that the rate of electroplating increases by increase of concentration in case of electroplating of copper. The percentage of acceleration range from 15 to 60 % depend on organic additives and its concentration. In case of electroplating of steel the rate of deposition decreases and the percentage of inhibition ranged from 11.8 to 35.3 % depending on the type of organic additives and its concentrations. Langmuir and kinetic adsorption isotherm were studied.