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Characterization of batch-microfabricated scanning electrochemical-atomic force microscopy probes

机译:批式微制造扫描电化学原子力显微镜探针的表征

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A procedure for the batch microfabrication of scanning electrochemical-atomic force microscopy (SECM-AFM) probes is described. The process yields sharp AFM tips, incorporating a triangular-shaped electrode (base width 1 mum, height 0.65 mum) at the apex. Microfabrication was typically carried out on 1/4 3-in. wafers, yielding 60 probes in each run. The measured spring constant of the probes was in the range 1-1.5 N m(-1). To date, processing has been carried out twice successfully, with an estimated success rate for the fabrication process in excess of 80%, based on field emission-scanning electron microscopy imaging of all probes and current-voltage measurements on a random selection of similar to30 probes. Steady-state voltammetric measurements for the reduction of Ru(NH3)(6)(3+) in aqueous solution indicate that the electrode response is well-defined, reproducible, and quantitative, based on a comparison of the experimental diffusion-limited current with finite element simulations of the corresponding mass transport (diffusion) problem. Topographical imaging of a sputtered Au film with the SECM-AFM probes demonstrates lateral resolution comparable to that of conventional Si3N4 AFM probes. Combined electrochemical-topographical imaging studies have been carried out on two model substrates: a 10-mum-diameter disk ultramicroelectrode (UME) and an array of 1-mum-diameter UMEs, spaced 12.5 pm apart (center to center). In both cases, an SECM-AFM probe was first employed to image the topography of the substrates. The tip was then moved back a defined distance from the surface and use to detect Ru(NH3)(6)(2+) produced at the substrate, biased at a potential to reduce Ru(NH3)(6)(3+), present in bulk solution, at a diffusion-controlled rate (substrate generation-tip collection mode). These studies establish the success of the batch process for the mass microfabrication of SECM-AFM tips.
机译:描述了用于扫描电化学原子力显微镜(SECM-AFM)探针的批量微制造的程序。该过程产生了尖锐的AFM尖端,在尖端处合并了三角形电极(基部宽度为1毫米,高度为0.65毫米)。微细加工通常在1/4 3-in上进行。晶片,每次运行可产生60个探针。测得的探针弹簧常数在1-1.5 N m(-1)范围内。迄今为止,基于所有探头的场发射扫描电子显微镜成像和在类似于30的随机选择上进行的电流-电压测量,加工已经成功地进行了两次,制造过程的成功率估计超过80%。探针。稳态伏安法测量水溶液中Ru(NH3)(6)(3+)的还原性表明,根据实验的扩散极限电流与电导率的比较,电极响应是定义明确,可重现和定量的。相应的质量传输(扩散)问题的有限元模拟。用SECM-AFM探针对溅射的Au膜进行的形貌成像表明,横向分辨率可与常规Si3N4 AFM探针相媲美。在两个模型基底上进行了组合的电化学-地形成像研究:直径为10微米的盘形超微电极(UME)和直径为12.5 pm的直径为1微米的UME阵列(中心到中心)。在这两种情况下,首先采用SECM-AFM探针对基材的形貌成像。然后将笔尖从表面移回确定的距离,并用于检测在基板上产生的Ru(NH3)(6)(2+),该电位偏置为可还原Ru(NH3)(6)(3+)的电位,存在于散装溶液中,且扩散控制速率(基质生成尖端收集模式)。这些研究为SECM-AFM尖端的大规模微细加工批量生产成功建立了基础。

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