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首页> 外文期刊>電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials >Chip Design of Structure Monitoring Sensor Driving IC for Telemetries Applications
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Chip Design of Structure Monitoring Sensor Driving IC for Telemetries Applications

机译:遥测应用结构监测传感器驱动IC的芯片设计

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This paper proposer a chip and implementation of optical fiber sensor IC for structure monitoring system. We studied and concluded the specifications required in the structure monitoring system which can drive and receive the signal. The adopted topology was possible to implemented to make an IC. In order to monitor the signal generated from structure, the system is divided into a transmitter and receiver. In this applications because the band of the signal is lower than a few hundred kHz, it was necessary to use DC coupling interconnection between circuits, and designed to focus on gain and stability instead of the operating speed.
机译:本文提出了一种用于结构监测系统的光纤传感器IC芯片及其实现。我们研究并总结了可驱动和接收信号的结构监测系统所需的规格。所采用的拓扑可以实现以制造IC。为了监视从结构产生的信号,系统分为发射器和接收器。在此应用中,由于信号的频带低于几百kHz,因此有必要在电路之间使用直流耦合互连,并且设计时应着重于增益和稳定性而不是工作速度。

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