SiP technology will have to go together with global circuit design - ASET E-SI technology R&D and application created by global SiP

Manabu Bonkohara

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SiP technology will have to go together with global circuit design - ASET E-SI technology R&D and application created by global SiP

机译：SiP技术必须与全球电路设计结合在一起-全球SiP创建的ASET E-SI技术研发和应用

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ASET Electronics System Integration R&D Minute and the Technology Installation of 3D stacked LSI, Opt-Electronics packaging and Optimum circuit structure with Lowest EMI/EMC. And then Discussion for SiP.

机译：ASET电子系统集成研发纪要和3D堆叠LSI技术安装，光电封装以及具有最低EMI / EMC的最佳电路结构。然后讨论SiP。

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《電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials》 |2002年第637期|共6页
作者
Manabu Bonkohara;
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原文格式 PDF
正文语种 jpn
中图分类一般性问题;
关键词
Electronic system-integration; System in a package; 3 dimensional stacking; Opt-electronics; Optimum design for low noise circuit; Fine noise analysis;

机译：电子系统集成;系统封装;三维堆叠;光电;低噪声电路的优化设计;精细噪声分析;

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1. SiP technology will have to go together with global circuit design - ASET E-SI technology R&D and application created by global SiP [J] . Manabu Bonkohara 電子情報通信学会技術研究報告. シリコン材料·デバイス. Silicon Devices and Materials . 2002,第637期

机译：SiP技术必须与全球电路设计结合在一起-全球SiP创建的ASET E-SI技术研发和应用
2. System in package (SiP) technology: fundamentals, design and applications [J] . Santagata Fabio, Sun Jianwen, Iervolino Elina, Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2018,第4期

机译：包装中的系统（SIP）技术：基本原理，设计和应用
3. Design of SIPC-based complementary LC-QVCO in 0.18-mm CMOS technology for WiMAX application [J] . Harikrishnan Ramiah, Tun Zainal Azni Zulkifli, Noramalia Sapiee Microelectronics international: Journal of ISHM--Europe, the Microelectronics Society--Europe . 2010,第1期

机译：用于WiMAX的采用0.18 mm CMOS技术的基于SIPC的互补LC-QVCO设计
4. First Global Application of Simultaneous Injection Production SIP Technology Using Dual Concentric Strings with ESP [C] . N.Al-Maqsseed, E.Anthony, R.Bhagavatula SPE Annual Technical Conference and Exhibition . 2018

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SiP technology will have to go together with global circuit design - ASET E-SI technology R&D and application created by global SiP

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