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Anisotropy Field and Core Loss of Highly Resistive (CoFeB)-(SiO_2) Films

机译:高阻(CoFeB)-(SiO_2)薄膜的各向异性场和铁损

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Highly resistive (CoFeB)-(SiO_2) films were deposited on glass substrates by conventional rf-cosputtering as thin-film cores for micro power devices.The effects of annealing on the magnetic properties and resistivity were investigated, and showed a possibility of controlling the permeability and core loss of the films by induced anisotropy. The films exhibited low coercivities of 0.2-0.5 Oe, together with high resistivities of about 400 #mu# #OMEGA# cm and high relative permeability of more than 1000. The core loss of the films was about 1.5 J/m~3 at 1 MHz for a maximum flux density of B_m = 0.1 T. The films have good potential for use as thin film cores.
机译:通过常规的射频共溅射将高电阻(CoFeB)-(SiO_2)薄膜沉积在玻璃基板上,作为微功率器件的薄膜芯材。研究了退火对磁性能和电阻率的影响,并显示了控制磁性能和电阻率的可能性。各向异性引起薄膜的磁导率和磁芯损耗。薄膜表现出0.2-0.5 Oe的低矫顽力,约400#mu##OMEGA#cm的高电阻率和超过1000的高相对磁导率。薄膜的铁损在1时约为1.5 J / m〜3最大磁通密度B_m = 0.1 T时为MHz,该膜具有用作薄膜芯的良好潜力。

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