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Microstructural analysis of the A356 Al alloy produced by the evaporative pattern casting process

机译:蒸发压铸工艺生产A356铝合金的组织分析。

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This study investigated the influence of several processing parameters, including the gating system design, the coating thickness, the application of a vacuum and the pouring temperature, on the microstructures of the EPC A356 Al alloy. Due to the endothermic nature of the degradation reactions of the EPS patterns and the sequential flow characteristic in the Al EPC molds, the melt front experiences a constant chilling effect during the pattern I cavity filling process. As a result, the microstructures of the EPC Al castings differ slightly from those produced in the conventional empty cavity molds. It has been found that, in the EPC process, the Al-Si eutectic content increases slightly toward the, downstream of the castings, and that an accumulated eutectic zone in the tip of 'the castings (melt front) can be observed as well. Nevertheless, in the CO{sub}2 process, the eutectic content remains more or less constant along the flow direction of the castings, and also no accumulation of eutectic phase has been detected at the melt front. The present results indicate that the SDAS is reduced by changing the gating system from S-T-V to T-S-H, but is increased with increasing the coating thickness and the pouring temperature, and also by the application of a vacuum. Regarding the casting porosity, the results show that the porosity content decreases progressively from the gate entrance toward the melt front. In addition, the porosity content is only slightly affected by different gating systems' employed and by varying the coating thickness, but is significantly increased by raising the pouring temperature and by the application of a vacuum.
机译:这项研究调查了几个工艺参数,包括浇口系统设计,涂层厚度,真空度和浇注温度对EPC A356铝合金微观组织的影响。由于EPS图案降解反应的吸热特性和Al EPC模具中的顺序流动特性,在图案I型腔填充过程中,熔体前沿经历了恒定的冷却效果。结果,EPC Al铸件的显微组织与常规空腔铸模中产生的显微组织略有不同。已经发现,在EPC过程中,Al-Si共晶含量朝着铸件的下游略微增加,并且还可以观察到在铸件的尖端(熔体前沿)中的累积的共晶区。然而,在CO {sub} 2过程中,共晶含量沿铸件的流动方向或多或少保持恒定,并且在熔体前沿未检测到共晶相的积累。目前的结果表明,通过将浇口系统从S-T-V更改为T-S-H可以降低SDAS,但是随着涂层厚度和浇注温度的增加以及真空的应用,SDAS会增加。关于铸件孔隙率,结果表明,孔隙率含量从浇口入口到熔体前沿逐渐降低。另外,孔隙率含量仅受所采用的不同浇口系统和改变涂层厚度的影响很小,但通过提高浇铸温度和施加真空度会显着增加。

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