Displacement adjusting method for beam spring of miniature relays using laser forming

摘要

In order to realize a micro mechanical relay, the new technology of adjusting a beam spring by using laser has been developed. While IT-related mechanical relays are miniaturized increasingly, the needs of non-contact processing by laser forming, which is not influenced by the spring back, are increasing. However, since the beam spring used for a relay has thin thickness and high thermal conductivity, if laser is irradiated several times, the influence of residual stress will become dominant. As a result, the displacement adjustment becomes difficult and the problem in which the surface receives damage occurs. Then, taking advantage of laser forming, which is not influenced by the spring back, the technique of repeating control of measurement and beam path was applied. Consequently, with the few number of times of irradiation, the displacement of the beam spring can be adjusted without damage in the surface. This becomes possible to apply laser forming to characteristic adjustment of a relay.