This report introduces Fujikura's all-polyimide IVH (interstitial Via Hole)-multi-layer circuit boards and device-embedding technology. Employing thin polyimide film as insulation layers, the boards using these technologies feature a very thin structure and excellent reliability. As IVHs connecting adjacent layers are filled with special conductive paste, this allows high-density wiring, as well as simple fabrication. In addition, the embedding technology enables various 3D arrangements of LSIs and passive components in a multi-layer circuit board. IVHs and embedding technology will enable drastically reduced size of circuit board and the shortest signal path and thus accelerate miniaturization and increase in performance of electronic devices.
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