首页> 外文期刊>立命館大学理工学研究所紀要 >The effect of thermal annealing on the Ni/p-GaN interface
【24h】

The effect of thermal annealing on the Ni/p-GaN interface

机译:热退火对Ni / p-GaN界面的影响

获取原文
获取原文并翻译 | 示例
       

摘要

The interface properties of Ni/p-GaN were investigated by ultra-violet photoemission spectroscopy. It was found that residual oxide on p-GaN surface was removed by Ni deposition, and the diffusion of Au and Ni was enhanced with annealing in O{sub}2 ambient. Such annealing effects result in a direct contact of Au with atomically clean GaN in Au/Ni/p-GaN structure. From these results, cleaning effect of Ni and the enhancement of Ni migration may play an important role in making ohmic contact to p-GaN in Au/Ni/p-GaN system.
机译:通过紫外光发射光谱法研究了Ni / p-GaN的界面特性。发现通过Ni沉积去除了p-GaN表面上的残留氧化物,并且通过在O {sub} 2环境中的退火增强了Au和Ni的扩散。这种退火效应导致Au与Au / Ni / p-GaN结构中原子清洁的GaN直接接触。从这些结果来看,Ni的清洁效果和Ni迁移的增强可能在与Au / Ni / p-GaN系统中的p-GaN形成欧姆接触中起重要作用。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号