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Micro-Machining by Ultrafast Laser and Its Future Development

机译:超快激光微加工及其未来发展

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摘要

The material removal mechanism by laser micro-machining have two basic forms: pyrolysis and photolysis. The processing via photolysis removes materials in a way that photons break the interatomic bonds of the material directly, and the corresponding machining accuracy will be much higher than that via pyrolysis. The femtosecond laser has a characteristic of extremely short pulse, whose working mechanism falls in photolysis category. The research on femtosecond laser applications has not been widely carried out at present in Taiwan. This research was planned on the fundamental investigation and a comparison was made with the Nd:YVO{sub}4 laser which has been widely applied in industry.
机译:激光微加工去除材料的机理有两种基本形式:热解和光解。通过光解进行的处理以光子直接破坏材料的原子间键的方式去除材料,并且相应的加工精度将比通过热解的加工精度高得多。飞秒激光器具有脉冲极短的特点,其工作机制属于光解范畴。目前,台湾尚未对飞秒激光的应用进行广泛的研究。这项研究计划在基础研究的基础上进行,并与已在工业中广泛应用的Nd:YVO {sub} 4激光器进行了比较。

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