Self-Aligned Flip-Chip Assembly of Monolithically Integrated Photo-Receiver with Optical Waveguides

摘要

We fabricated optical waveguides on photodiode chips. The chip monolithically integrated with optical interconnection were packaged by using flip-chip bonding by SnAu solder micro-bumps. An acceptable loss of less than 1 dB was achieved with passive alignment. This indicates our structure is promising for use in the construction of future ultra-high speed and cost-effective photo-receiver system.