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Formation mechanism of Pt-H complexes in Pt doped Si by chemical etching

机译:Pt掺杂Si中Pt-H配合物的化学刻蚀机理

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The formation mechanism of platinum-hydrogen (Pt-H) complexes introduced by hydrogen injection into Pt-doped n-type Si wafers during wet-chemical etching is elucidated taking the influence of phosphorous (P) into consideration. Using deep-level transient spectroscopy (DLTS) depth profiling and capacitance-voltage analysis, the concentration profiles of Pt-H complex and P-H pair in Pt-undiffused and diffused n-type Si are measured for various etching rates, etching temperatures, and P and Pt concentrations, Moreover, to examine the influence of the space charge layer formed near the surface on the formation of P-H pair, P-H pair concentration profiles are compared with boron-hydrogen (B-H) ones in B doped p-type Si wafers, in which B is negatively charged in the space charge layer, contrary to positively charged P, From these results, it is clarified that the formations of Pr-H complexes and P-H pair are mainly dominated by the electric field in the space charge layer formed by positive P ions.
机译:考虑到磷(P)的影响,阐明了在湿化学腐蚀过程中通过氢注入Pt掺杂的n型Si晶片中引入的铂-氢(Pt-H)络合物的形成机理。使用深层瞬态光谱(DLTS)深度剖析和电容电压分析,针对各种蚀刻速率,蚀刻温度和P,测量了Pt未扩散和扩散的n型Si中Pt-H配合物和PH对的浓度分布此外,为了检查在表面附近形成的空间电荷层对PH对形成的影响,在B掺杂的p型Si晶片中,将PH对浓度分布与硼氢(BH)浓度分布进行了比较。这些结果表明,Pr-H配合物和PH对的形成主要受正电荷形成的空间电荷层中的电场支配。离子

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