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Equipment for Chemical Etching and Polishing of the Plate Surfaces

机译:板表面化学蚀刻和抛光设备

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摘要

Various sets for chemical etching and chemical dynamic polishing of the plate surface are considered in the context of various problems of the material science. The sets presented provide the laminar hydrodynamic regimen of the liquid phase agitation in combination with rotation of polishing plates around their axis, thus forming conditions of equally accessible reaction sample surface. The results of experimental testing of the sets developed are presented.
机译:在材料科学的各种问题的背景下,考虑了用于板表面的化学蚀刻和化学动态抛光的各种装置。所展示的套件提供了液相搅拌的层流流体动力学方案,并结合了抛光板绕其轴线的旋转,从而形成了反应样品表面均等可及的条件。介绍了所开发的装置的实验测试结果。

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