Development of Ultra-miniaturized Multilayer Ceramic Chip Components and Multilayer Module

摘要

High-speed laser drilling using low laser power and flexible circuit layout were applied to the fabrication of 3-dimensional circuits in multilayer ceramics of miniaturized chip inductors and high-frequency power amplifier modules. The optimized combination of pulse YAG laser energy and the laser absorption coefficient of machined materials realized ultra-fine through-holes formed in thin ceramic green sheets without damaging plastic film where ceramic slurry was cast drilling based on thermal ablation.