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TCAD Simulation for Virtual Design of Semiconductor Processes

机译:半导体工艺虚拟设计的TCAD仿真

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摘要

The development time for new semiconductor devices is becoming longer, accompanying the shrinkage of design rules, strict process specifications, and increase in the number of process steps. In order to reduce the development time, a decrease in the number of experiments is strongly desired. Technology CAD (TCAD) is one possible candidate to improve the efficiency of development by simulating processes virtually. However, topography simulation, one part of TCAD, has not been widely used due to its inability to deal with complex chemical reactions. Toshiba has therefore been developing new topography simulation models based on plasma diagnosis and surface analysis. We have been successfully applying these models to semiconductor processes to reduce the development time.
机译:随着设计规则的缩小,严格的工艺规范以及工艺步骤数量的增加,新半导体器件的开发时间越来越长。为了减少显影时间,强烈希望减少实验次数。技术CAD(TCAD)是通过虚拟模拟流程来提高开发效率的一种可能的选择。但是,地形仿真是TCAD的一部分,由于无法处理复杂的化学反应而没有得到广泛使用。因此,东芝一直在开发基于等离子体诊断和表面分析的新形貌仿真模型。我们已经成功地将这些模型应用于半导体工艺,以减少开发时间。

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