Surface mount technology for over-40-Gb/s ICs

摘要

A new surface mount technology for over-40-Gb/s ICs has been developed. The technology features 8-mm-square leadless chip carrier packages and four-layer resin printed circuit boards. It was applied to build a prototype InP HFET multichip 1:4 DEMUX module, that operates at 45 Gb/s. This technology is promising for small, low-cost IC modules for over-40-Gb/s optical communication systems.