Development of micro spherical probe machining with combination WEDG technology and one pulse discharge

摘要

Microprobe have been widely used in metrology industrial field, such as scanning probe microscopy (SPM), Atomic Force Microscopes (AFM), surface non-destructive measurement device and medical detect device. Until now the microprobes manufacturing is mainly depended on semiconductor process. It is possible to achieve mass-production of microprobes. However, microprobe are limited on semiconductor material. Since the development of WEDG (wire electro discharge grinding) technology, it becomes easier to fabricate a microprobe in metal and alloy. Twin-WEDG system is improved to fabricate a microprobe more efficiency than conventional method. It is also available to machine various kinds of shape microprobes with application of WEDG's NC program control. However, it does not only take much time to machine micro spherical Probe by WEDG technology, but also the surface of roughness of spherical probe is limited on electronic discharge crater about 0.5μ Rmax. In this study, we will propose a new method including WEDG technology and one pulse electronic discharge phenomenon to fabricate a micro-spherical probe. This new prototyping method can fabricate micro spherical probe instantaneously with solid probe after WEDG machining. We also can use the micro-spherical probe as a microelectrode to machine half micro-spherical cavity.