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Study on optimum thickness of interlayer in ceramic/metal joints

机译:陶瓷/金属接头中间层的最佳厚度研究

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摘要

A major problem in ceramic/metal joint is thermal expansion coefficient mismatch between ceramics and metal. This thermal expansion coefficient mismatch causes serious residual stresses at the interface of the ceramic/metal joint, which generated during joint-cooling process. Then, an interlayer, which is ductile metal such as copper, nickel and so on, is inserted between ceramics and metal because of relaxing the residual stress. It should be considered that thickness of interlayer have significant influence on the joint strength with considering the residual stress. In this study, it paid attention to the thickness of interlayer, and the optimum thickness of interlayer was discussed from a viewpoint of the stresses based on simulation model analysis as well as 4 point bending tests, considering the residual stresses, which were analyzed using three-dimensional plasto-elastic finite element method. As a result of the analysis, residual stress increased with decreasing of the interlayer thickness. The superposing stress of the applied bending stress and the residual stress showed minimum value in the case of the interlayer thickness of 0.2mm. On the other hand, paying notice to the result of the bending test as well as the analysis, the joint specimen showed the highest bending strength in the case of the interlayer thickness of 0.2mm. Furthermore, the scatter of joint strength is apparently small in this thickness compared with in the other thickness.
机译:陶瓷/金属接合处的主要问题是陶瓷和金属之间的热膨胀系数不匹配。这种热膨胀系数不匹配会在陶瓷/金属接头的界面处产生严重的残余应力,该残余应力会在接头冷却过程中产生。然后,由于缓和了残余应力,因此在陶瓷和金属之间插入了中间层,该中间层是易延展的金属,例如铜,镍等。在考虑残余应力的情况下,应考虑中间层的厚度对接头强度有重要影响。本研究关注中间层的厚度,并基于应力的观点,基于模拟模型分析以及四点弯曲试验,在考虑残余应力的基础上,讨论了中间层的最佳厚度,并采用三种方法进行了分析。维塑性弹性有限元方法。分析的结果是,残余应力随着层间厚度的减小而增加。在层间厚度为0.2mm的情况下,施加的弯曲应力与残余应力的叠加应力为最小值。另一方面,注意弯曲试验的结果和分析,在中间层厚度为0.2mm的情况下,接合试样显示出最高的弯曲强度。此外,与其他厚度相比,该厚度的接合强度的分散明显较小。

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