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首页> 外文期刊>Journal of Thermoplastic Composite Materials >A Numerical and Experimental Study on Thermal Conductivity of Particle Filled Polymer Composites
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A Numerical and Experimental Study on Thermal Conductivity of Particle Filled Polymer Composites

机译:颗粒填充聚合物复合材料导热系数的数值与实验研究

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摘要

In this study,thermal conductivity of particle filled polymer composites is investigated numerically and experimentally.In the numerical study,the finite-element program ANSYS is used to calculate the thermal conductivity of the composite by using the results of the thermal analysis.Three-dimensional models are used to simulate the microstructure of composite materials for various filler concentrations at various ratios of thermal conductivities of filler to matrix material.The models used to simulate particle filled composite materials are cubes in a cube lattice array and spheres in a cube lattice array.A modified hot wire method is used to measure the thermal conductivity of the composites consisting of a high-density polyethylene(HDPE)matrix filled with tin particles up to 16% by volume.The experimentally measured thermal conductivities are compared with numerically calculated ones by using the spheres in cube model and also with the already existing theoretical and empirical models.At low particle content,up to 10% of volume content of tin filler,numerical estimation and all other models except for the Cheng and Vachon model,predict well the thermal conductivity of the composite.For more heavily filled composites there is an exponential increase in thermal conductivity and most of the models fail to predict thermal conductivity in this region.
机译:本研究对颗粒填充聚合物复合材料的热导率进行了数值和实验研究。在数值研究中,使用有限元程序ANSYS根据热分析结果计算了复合材料的热导率。三维在填充剂与基体材料的热导率不同的比率下,使用各种模型来模拟复合材料在不同填料浓度下的微观结构。用于模拟填充颗粒的复合材料的模型是立方体格阵列中的立方体和立方体格阵列中的球体。一种改进的热线法用于测量由高密度聚乙烯(HDPE)基质组成的复合材料的导热率,该基质填充了体积百分比高达16%的锡颗粒,然后将实验测量的导热率与通过数值计算得出的导热率进行比较立方体模型中的球体以及已经存在的理论和经验模型在低颗粒含量,不超过锡填料体积含量10%的情况下,通过数值估算以及除Cheng和Vachon模型之外的所有其他模型,可以很好地预测复合材料的导热系数。对于更重填充的复合材料,存在指数关系导热系数增加,大多数模型无法预测该区域的导热系数。

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