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首页> 外文期刊>Journal of the European Ceramic Society >An analysis of deformation mechanism in the Si_3N_4-AgCuTi + SiCp-Si_3N_4 joints by digital image correlation
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An analysis of deformation mechanism in the Si_3N_4-AgCuTi + SiCp-Si_3N_4 joints by digital image correlation

机译:通过数字图像相关分析Si_3N_4-AgCuTi + SiCp-Si_3N_4接头的变形机理

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摘要

The composite filler shows more advantages than traditional brazing alloys, and has been widely introduced into joining ceramics or ceramics to metals. However, the underlying formation and strengthening mechanisms remained uncertain in the joint. In current research, SiCp (p = particle) was incorporated in Ag-Cu-Ti brazing alloy for joining Si_3N_4 ceramic. Nanoindentation method was introduced for probing the mechanical properties of reaction phases between the brazing alloy and SiCp. A novel formation mechanism model was thus proposed. In addition, optical microscope (OM) in conjunction with digital image correlation (DIC) techniques has been first applied to elucidate the deformation mechanism in the joint with and without SiC incorporation. The following reasons were believed to strengthen the brazed joint: load-transfer ability of SiCp, plastic relaxation in the brazing layer and CTE reduction of the composite filler.
机译:与传统的钎焊合金相比,复合填料具有更多的优势,并且已被广泛用于将陶瓷或陶瓷与金属连接起来。但是,联合的潜在形成和加强机制仍然不确定。在当前的研究中,SiCp(p =颗粒)被掺入Ag-Cu-Ti钎焊合金中以连接Si_3N_4陶瓷。引入纳米压痕法研究了钎焊合金与SiCp之间反应相的力学性能。因此提出了一种新颖的形成机理模型。此外,光学显微镜(OM)结合数字图像相关(DIC)技术已被首先用于阐明结合和不结合SiC的接头变形机制。人们认为,以下原因可增强钎焊接头的强度:SiCp的载荷传递能力,钎焊层的塑性松弛和复合填料的CTE降低。

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