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Increasing substrate resistance to improve the turn-on uniformity of a high-voltage multi-finger GG-nLDMOS

机译:增加衬底电阻以改善高压多指GG-nLDMOS的导通均匀性

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摘要

With the impact of the non-uniform turn-on phenomenon, the ESD robustness of high-voltage multi-finger devices is limited. This paper describes the operational mechanism of a GG-nLDMOS device under ESD stress conditions and analyzes the reason that causes the non-uniform turn-on characteristics of a multi-finger GG-nLDMOS device. By means of increasing substrate resistance, an optimized device structure is proposed to improve the turn-on uniformity of a high-voltage multi-finger GG-nLDMOS. This approach has been successfully verified in a 0.35 μm 40 V BCD process. The TLP test results reveal that increasing the substrate resistance can effectively enhance the turn-on uniformity of the 40 V multi-finger GG-nLDMOS device and improve its ESD robustness.
机译:受不均匀导通现象的影响,高压多指设备的ESD鲁棒性受到限制。本文介绍了ESD应力条件下GG-nLDMOS器件的工作机制,并分析了导致多指GG-nLDMOS器件导通特性不均匀的原因。通过增加衬底电阻,提出了一种优化的器件结构,以改善高压多指GG-nLDMOS的导通均匀性。此方法已在0.35μm40 V BCD工艺中成功验证。 TLP测试结果表明,增加衬底电阻可以有效增强40 V多指GG-nLDMOS器件的导通均匀性,并提高其ESD鲁棒性。

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