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Evaluating the energy consumption and the silicon area of on-chip interconnect architectures

机译:评估片上互连架构的能耗和硅面积

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Sophisticated on-chip interconnects using packet and circuit switching techniques were recently proposed as a solution to non-scalable shared-bus schemes currently used in Systems-on-Chip (SoCs) implementation. Different interconnect architectures have been studied and adapted for SoCs to achieve high throughput, low latency and energy consumption, and efficient silicon area. Recently, a new on-chip interconnect architecture by adapting the WK-recursive network topology structure has been introduced for SoCs. This paper analyses and compares the energy consumption and the area requirements of Wk-recursive network with five common on-chip interconnects, 2D Mesh, Ring, Spidergon, Fat-Tree and Butterfly Fat-Tree. We investigated the effects of load and traffic models and the obtained results show that the traffic models and load that ends processing elements has a direct effect on the energy consumption and area requirements. In these results, WK-recursive interconnect generally has a higher energy consumption and silicon area requirements in heavy traffic load.
机译:最近提出了使用分组和电路交换技术的先进的片上互连技术,以作为当前在片上系统(SoC)实现中使用的不可扩展的共享总线方案的解决方案。已经研究了不同的互连体系结构,并将它们适用于SoC,以实现高吞吐量,低延迟和能耗以及有效的硅面积。最近,已针对SoC引入了一种新的片上互连架构,该架构通过适应WK递归网络拓扑结构而获得。本文分析并比较了Wk递归网络与5种常见的片上互连(二维网格,环形,蜘蛛形,胖树和蝴蝶胖树)的能耗和面积要求。我们研究了负载和交通模型的影响,获得的结果表明,结束处理元素的交通模型和负载对能耗和面积需求有直接影响。在这些结果中,WK递归互连通常在高流量负载中具有更高的能耗和硅面积要求。

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