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首页> 外文期刊>Journal of Superconductivity and Novel Magnetism >Electrothermal Modeling of Coated Conductor for a Resistive Superconducting Fault-Current Limiter
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Electrothermal Modeling of Coated Conductor for a Resistive Superconducting Fault-Current Limiter

机译:电阻式超导故障限流器的涂层导体电热建模

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摘要

Coated conductors are very promising for the design of a novel and efficient superconducting fault-current limiter (SFCL). The thermal and electrical behaviors of this type of SFCL in the presence of over-critical currents need to be investigated in detail to master its performance in a power grid. In this paper, an Electrothermal Model of a Coated Conductor (ETMCC), not simulated in the literature, is implemented and introduced in the library of MATLAB software. An algorithm to solve the differential equations characterizing the superconducting material is developed using the Runge-Kutta method. In this context the ETMCC under over-critical current is performed. Different dimensions and substrate configurations of the sandwich layers are considered. In order to improve the high-temperature superconductor (HTS)-FCL design, the influence of the substrate and shunted layers (using different materials) on the thermal stability is investigated. The simulation results are generalized, thus allowing us to determine the current threshold to achieve thermal stability of the HTS-FCL at any point of the coated conductor.
机译:对于设计新颖,高效的超导故障电流限制器(SFCL),涂层导体非常有前途。需要详细研究这种类型的SFCL在存在超临界电流的情况下的热和电性能,以掌握其在电网中的性能。在本文中,未在文献中进行仿真的涂层导体电热模型(ETMCC)已实现,并已在MATLAB软件库中引入。使用Runge-Kutta方法开发了一种求解表征超导材料的微分方程的算法。在这种情况下,将在超临界电流下执行ETMCC。考虑了夹心层的不同尺寸和衬底构造。为了改进高温超导体(HTS)-FCL设计,研究了衬底和分流层(使用不同的材料)对热稳定性的影响。对模拟结果进行了概括,从而使我们能够确定电流阈值,以实现HTS-FCL在涂层导体任何一点的热稳定性。

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