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Influence of thermal process on microstructural and physical properties of ambient pressure dried hydrophobic silica aerogel monoliths

机译:热处理对常压干燥的疏水性二氧化硅气凝胶整料微结构和物理性能的影响

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摘要

The experimental results of thermal process on the microstructural and physical properties of ambient pressure dried hydrophobic silica aerogel monoliths are reported and discussed. With sodium silicate as precursor, ethanol/ hexamethyldisiloxane/hydrochloric acid as surface modification agent, the crack-free and high hydrophobic silica aerogel monoliths was obtained possessing the properties as low density (0.096 g/cm~3), high surface area(651 m~2/g),high hydrophobicity (~147°) and low thermal conductivity (0.0217 Wm/K). Silica aerogels maintained hydrophobic behavior up to 430 °C. After a thermal process changing from room temperature to 300 °C, the hydrophobicity remained unchanged (~128°), of which the porosity was 95.69% and specific density about 0.094 g/cm~3. After high temperature treatment (300-500 °C), the density of final product decreased from 0.094 to 0.089 g/cm~3 and porosity increased to 96.33%. With surface area of 466 m~2/g, porosity of 91.21 % and density about 0.113 g/cm~3, silica aerogels were at a good state at 800 °C. Thermal conductivities at desired temperatures were analyzed by the transient plane heat source method. Thermal conductivity coefficients of silica aerogel monoliths changed from 0.0217 to 0.0981 Wm/K as temperature increased to 800 °C, revealed an excellent heat insulation effect during thermal process.
机译:报道并讨论了热处理对环境压力干燥的疏水性二氧化硅气凝胶整料的微观结构和物理性能的实验结果。以硅酸钠为前驱体,以乙醇/六甲基二硅氧烷/盐酸为表面改性剂,制得无裂纹,高疏水性的二氧化硅气凝胶整料,具有低密度(0.096 g / cm〜3),高表面积(651 m)的特性。 〜2 / g),高疏水性(〜147°)和低热导率(0.0217 Wm / K)。二氧化硅气凝胶在430°C时仍保持疏水性。经过从室温到300°C的热处理后,疏水性保持不变(〜128°),其中孔隙率为95.69%,比重约为0.094 g / cm〜3。高温(300-500°C)处理后,最终产物的密度从0.094降低至0.089 g / cm〜3,孔隙率提高至96.33%。二氧化硅气凝胶的表面积为466 m〜2 / g,孔隙率为91.21%,密度约为0.113 g / cm〜3,在800°C时处于良好状态。通过瞬态平面热源法分析了所需温度下的热导率。随着温度升高至800°C,二氧化硅气凝胶整料的导热系数从0.0217变为0.0981 Wm / K,显示出优异的隔热效果。

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