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Dielectric properties and their dependence of polyetherimide/bismaleimide blends for high performance copper clad laminates

机译:高性能覆铜板用聚醚酰亚胺/双马来酰亚胺共混物的介电性能及其依赖性

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Developing high performance matrix for High Performance Copper Clad Laminates (HPCCLs) has been a fascinating focus in the micro-electric industry since the beginning of this century. This article presents the first report on investigating the dielectric properties of a blend system (PEI/BD) based on polyetherimide (PEI) and o,o-diallyl bisphenol A (DBA) modified 4,4-bismaleimidodiphenyl methane (BDM), and discussing the dependence of dielectric properties on morphology, frequency and absorbed water. Results show that the morphology of the blend changes from a dispersed phase to completely co-continuous phase and perfect phase inversion, successively, as the content of PEI in the blend is increased. The dielectric properties of the PEI/BD system are not only frequency-dependent, but also morphology-dependent and moisture-dependent. The very good water resistance and extremely stable dielectric properties suggest that PEI/BD blends have great potential to be the matrices for fabricating HPCCLs and other advanced composites.
机译:自本世纪初以来,开发用于高性能覆铜箔层压板(HPCCL)的高性能基质一直是微电行业着迷的焦点。本文提供了有关研究基于聚醚酰亚胺(PEI)和邻,邻二烯丙基双酚A(DBA)改性的4,4-双马来酰亚胺二苯甲烷(BDM)的共混体系(PEI / BD)介电性能的第一份报告,并进行了讨论介电特性对形貌,频率和吸收水的依赖性。结果表明,随着共混物中PEI含量的增加,共混物的形态逐渐从分散相​​变为完全共连续相和完美的相转化。 PEI / BD系统的介电特性不仅取决于频率,而且还取决于形态和湿度。极好的耐水性和极稳定的介电性能表明,PEI / BD共混物有很大的潜力成为制造HPCCL和其他高级复合材料的基质。

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