RESIN CONTAINING DIELECTRIC FILLER FOR FORMATION OF BUILT-IN CAPACITOR LAYER OF PRINTED WIRING BOARD, COPPER DOUBLE CLAD LAMINATE HAVING DIELECTRIC LAYER FORMED WITH RESIN CONTAINING DIELECTRIC FILLER, AND PROCESS FOR PRODUCING COPPER DOUBLE CLAD LAMINATE

摘要

The double-sided copper clad laminate of a dielectric layer used in the capacitor built-in layer form, without the skeleton material is possible to form any of the film thickness, and further, it is an object to provide things having a high strength. ; In order to achieve the above object, "20 to 80 (a curing agent) parts by weight of epoxy resin, 20 to 80 according to the melted aromatic polyamide (polyamide) resin polymers, and required for the parts by weight of a solvent suitably made of a curing accelerator which is added a quantity and a binder resin, and the average particle diameter D _IA 1.O㎛ 0.1 ~, by weight cumulative particle diameter D ₅₀ is 0.2 ~ 2.0㎛ by the laser diffraction scattering type particle size distribution measuring method, also, by the weight cumulative particle diameter D ₅₀ and the image analysis hayeoseo using the average particle diameter D _IA to obtain the value of the degree of compaction is represented by D ₅₀ / D _IA the shape of a rectangle not more than 3.5 4 (球形) perovskite structure obtained by mixing a powder of a dielectric filler having a dielectric for embedded capacitor can be formed in a layer of the printed circuit board is to use a dielectric filler-containing resin and the like. ; Copper clad laminated board, printed wiring board, particle agglomeration, cohesion, haerip (解 粒) processing