A new fabrication process for uniform SU-8 thick photoresist structures by simultaneously removing edge bead and air bubbles

摘要

This paper proposes a new SU-8 fabrication process to simultaneously remove edge bead and tiny air bubbles by spraying out edge bead removal (EBR) fluid over the entire surface of photoresist. In particular, the edge bead and air bubbles can cause an air gap between a film mask and a photoresist surface during UV exposure. The diffraction effect of UV light by the air gap leads to inaccurate and non-uniform SU-8 patterns. In this study, we demonstrate a simple method using EBR treatment to simultaneously eliminate the edge bead at the edge of wafer and tiny air bubbles inside SU-8. The profiles of thickness variation of SU-8 films with/without the EBR treatment are measured. The results show that the proposed EBR treatment can successfully remove the edge bead and air bubbles over the entire SU-8 films. The average pattern uniformity of SU-8 is improved from 50.5% to 11.3% in the case of 200 μm thickness. This method is simple and inexpensive, compared to a standard EBR process, because it does not require specialized equipment and it can be applied regardless of substrate geometry (e.g. circular wafer and rectangular slide glass).