Direct molding of dry adhesives with anisotropic peel strength using an offset lift-off photoresist mold

摘要

We demonstrate for the first time a wafer scale, directly molded anisotropic dry adhesive made of silicone that can be produced in a two-mask process. We demonstrate that the peel strength of this adhesive is dependent on the amount of overhang of a thin flexible cap on the top of each fiber. By precisely placing the center of this cap offset to the center of the supporting post, the peel strength of the adhesive can be altered when pulled off in different directions.