Fabrication and characterization of suspended beam structures for SiO2 photonic MEMS

摘要

This paper proposes a microfabrication process for the reliable release of SiO2 beam structures. These structures are intended to be utilized in SiO2 photonic MEMS. A major fabrication challenge is the release of thick (> 10 mu m) SiO2 structures with high yield. A single mask process is developed based on temporary reinforcement of the SiO2 structure. A supporting layer of Si functions as a reinforcing layer during etching and release, thereby enabling a high fabrication yield. Furthermore, the process allows to create structures of which the final Si support thickness is configurable from tens of micrometers to zero, thereby providing additional design freedom.