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Identification of process parameters for microfabrication with excimer laser

机译:准分子激光识别微细加工的工艺参数

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摘要

The ablation of a polymethyl methacrylate (PMMA) substrate with a 248-nm long-pulsed KrF excimer laser is studied. PMMA is ablated at a laser pulse repetition rate (PRR) of 2, 5, and 10 Hz, and fluence varying from 0.2 to 1 J/cm(2). The coupling effects of multiple shots, PRR, and fluence on the etching depth and topography of PMMA are discussed. It is observed that the etching rate and the ablation depth increase with the increase in fluence. The increase in the ablation depth with fluence is more significant at a higher number of shots. It is also observed that the etching rate decreases with the number of shots for a given fluence. An optimal combination is selected for the fabrication of a 100-mu m-depth microchannel using styrene mask. The current microfabrication technique also demonstrates the use of low-cost masks. (C) 2007 Society of Photo-Optical Instrumentation Engineers.
机译:研究了用248 nm长脉冲KrF准分子激光对聚甲基丙烯酸甲酯(PMMA)基板的烧蚀。 PMMA以2、5和10 Hz的激光脉冲重复频率(PRR)消融,注量范围为0.2至1 J / cm(2)。讨论了多次注入,PRR和注量对PMMA蚀刻深度和形貌的耦合效应。观察到蚀刻速率和烧蚀深度随着注量的增加而增加。随着注射量的增加,消融深度的增加更为显着。还观察到,对于给定的注量,蚀刻速率随着喷射次数而降低。选择最佳组合以使用苯乙烯掩模制造100微米深的微通道。当前的微细加工技术还证明了低成本掩模的使用。 (C)2007年光电仪器工程师协会。

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