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Hierarchically porous binder-free silicalite-1 discs: a novel support for all-zeolite membraees

机译:分层多孔的无粘结剂silicalite-1圆盘:全沸石膜的新型支撑

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摘要

Thermal expansion mismatch between the zeolite film and the support is an important cause for the formation of defects and cracks during the fabrication and use of zeolite membranes. We have studied how silicalite-1 discs with a permeability comparable to commercially available alumina supports can be produced by pulsed current processing (PCP) as a novel substrate for all-zeolite membranes. Hierarchically porous and mechanically strong membrane supports where the surface area and crystallography of the silicalite-1 particles were maintained could be obtained by carefully controlling the thermal treatment during PCP consolidation. In situ X-ray diffraction and dilatometry showed that the coefficient of thermal expansion (CTE) of the silicalite-1 substrate was negative in the temperature range 200-800 ℃ while the commonly used alumina substrate displayed a positive CTE. The critical temperature variation, ΔT, and thicknesses for crack-free supported zeolite films with a negative CTE were estimated using a fracture energy model. Zeolite films with a thickness of 1 μm can only sustain a relatively modest ΔT of 100 degrees when supported onto alumina substrates while the all-zeolite membranes can support temperature variations above 500 degrees.
机译:沸石膜和载体之间的热膨胀失配是在沸石膜的制造和使用过程中形成缺陷和裂纹的重要原因。我们已经研究了如何通过脉冲电流处理(PCP)作为全沸石膜的新型基材来生产具有与市售氧化铝载体相当的渗透性的silicalite-1圆盘。可以通过仔细控制PCP固结过程中的热处理来获得保持硅胶1颗粒表面积和晶体学的分层多孔且机械强度高的膜载体。原位X射线衍射仪和膨胀仪显示硅沸石1衬底在200〜800℃的温度范围内的热膨胀系数(CTE)为负,而常用的氧化铝衬底的CTE为正。使用断裂能模型估算了CTE为负的无裂纹支撑沸石膜的临界温度变化,ΔT和厚度。厚度为1μm的沸石膜在支撑到氧化铝基材上时只能维持100度的相对适度ΔT,而全沸石膜可以支撑500度以上的温度变化。

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