首页> 外文期刊>Journal of nanoscience and nanotechnology >Effect of Gold Immersion Time on the Electrochemical Migration Property of Electroless Nickel/Immersion Gold Surface Finishing
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Effect of Gold Immersion Time on the Electrochemical Migration Property of Electroless Nickel/Immersion Gold Surface Finishing

机译:浸金时间对化学镍/浸金表面处理的电化学迁移性能的影响

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In this study, the electrochemical performance of an electroless nickel/immersion gold (ENIG) surface finish was evaluated as a function of the Au immersion time by the water immersion migration test. As the Au plating time increased, the electroless nickel phosphorous (EN-P) changed from amorphous to crystalline and then increased in crystallinity. X-ray diffraction (XRD) was used to evaluate the crystallinity of the plating layer. The electrical resistance of the electrodes was tracked as the sample was immersed in water with a 5 V bias. The microstructures of the electrodes after the electrochemical migration test were observed by using secondary electron microscopy (SEM) and energy dispersive spectroscopy (EDS). As the Au immersion time increased, the EN-P's crystallinity and Au thickness increased. This enhanced the electrochemical migration protection of the surface finish layer.
机译:在这项研究中,通过水浸迁移试验评估了化学镀镍/浸金(ENIG)表面涂层的电化学性能与金浸入时间的关系。随着Au镀时间的增加,化学镍磷(EN-P)从非晶态变为结晶态,然后结晶度增加。 X射线衍射(XRD)用于评估镀层的结晶度。当样品以5 V偏压浸入水中时,跟踪电极的电阻。通过二次电子显微镜(SEM)和能量色散光谱(EDS)观察电化学迁移试验后电极的微观结构。随着Au浸入时间的增加,EN-P的结晶度和Au厚度增加。这增强了表面整理层的电化学迁移保护。

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