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Localized CO2 laser annealing induced dehydrogenation/ablation and optical refinement of silicon-rich silicon dioxide film with embedded Si nanocrystals

机译:局域CO2激光退火诱导的含硅纳米晶的富硅二氧化硅薄膜的脱氢/烧蚀和光学细化

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摘要

CO2 laser annealing induced effects of dehydrogenation, Si nanocrystal precipitation, ablation, and optical refinement in PECVD grown SiO1.25 film are investigated. Dehydrogenation shrinks SiO1.25 thickness by 40 nm after annealing at laser intensity (P-laser) of 4 kW/cm(2) for 1.4 ms. As P-laser increases to 6 kW/cm(2), the photoluminescence (PL) red-shifts to 806 nm due to the size enlargement of Si nanocrystals, while a reduced optical bandgap energy from 3.3 to 2.43 eV and an enlarged refractive index from 1.57 to 1.87 are also observed. Transmission electron microscopy analysis reveals that the randomly oriented Si nanocrystals exhibit an average diameter of 5.3 nm and a volume density of 1.9 X 10(18) cm(-3). CO2 Laser ablation initiates at intensity higher than 7 kW/cm(2), which introduces numerous structural defects with a strong PL at 410 nm. Such an ablation inevitably leads to a blue-shifted optical bandgap energy from 2.43 to 2.76 eV as P-laser enlarges from 6 to 12 kW/cm(2) are concluded.
机译:研究了在PECVD生长的SiO1.25薄膜中,CO2激光退火引起的脱氢,Si纳米晶体沉淀,烧蚀和光学细化的效应。在4 kW / cm(2)的激光强度(P-laser)退火1.4 ms后,脱氢将SiO1.25的厚度收缩40 nm。当P激光增加到6 kW / cm(2)时,由于Si纳米晶体的尺寸增大,光致发光(PL)红移到806 nm,而光学带隙能量从3.3减小到2.43 eV,折射率增大从1.57到1.87也被观察到。透射电子显微镜分析表明,随机取向的Si纳米晶体的平均直径为5.3 nm,体积密度为1.9 X 10(18)cm(-3)。 CO2激光烧蚀的强度高于7 kW / cm(2),会引入许多结构缺陷,并在410 nm处具有很强的PL。随着P激光从6 kW / cm扩大到12 kW / cm(2),这种烧蚀不可避免地导致从2.43到2.76 eV的蓝移光学带隙能量。

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