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Electric and Mass Transport of a Carbon Nanotube Encapsulating a Copper Nano-Rod Studied by In-Situ Transmission Electron Microscopy

机译:原位透射电子显微镜研究碳纳米管包裹铜纳米棒的电和质量传输

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摘要

Electric properties and current-induced structural changes of carbon nanotubes (CNTs) encapsulating copper nano-rods were studied by in-situ transmission electron microscopy (TEM). The diameter and the length of a copper filled CNT were 18 nm and 256 nm, respectively. The thickness of the graphite layer was about 1 nm. The bias voltage was applied between the two ends of the CNT inside the TEM, and the current as well as TEM images were recorded simultaneously. At a bias voltage of 1.4 V, the current increased to 10 μA, corresponding to a current density of 4.0 × 10~6 A/cm~2, and at the same time the nano-rods inside the CNT started to move to an end of the CNT. After the movement of the nano-rods, an empty CNT was left. Resistivities of the CNT and the copper nano-rod were measured to be 3.0 × 10~(-5) Ωm and 1.2 × 10~(-4) Ωm, respectively.
机译:通过原位透射电子显微镜(TEM)研究了包裹铜纳米棒的碳纳米管(CNT)的电性能和电流诱导的结构变化。铜填充的CNT的直径和长度分别为18nm和256nm。石墨层的厚度为约1nm。在TEM内部的CNT的两端之间施加偏压,并且同时记录电流和TEM图像。在1.4 V的偏置电压下,电流增加到10μA,对应于4.0×10〜6 A / cm〜2的电流密度,与此同时,CNT内部的纳米棒开始移动到末端的碳纳米管。在纳米棒移动之后,留下了空的CNT。测得的CNT和铜纳米棒的电阻分别为3.0×10〜(-5)Ωm和1.2×10〜(-4)Ωm。

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