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首页> 外文期刊>Journal of Macromolecular Science. Physics >Investigation of Failure Mechanisms in Polymer Composites by Simultaneous Measurement of Ultra-Small-Angle Scattering and Acoustic Emission During the Deformation. II. Evaluation of the Interface Strength
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Investigation of Failure Mechanisms in Polymer Composites by Simultaneous Measurement of Ultra-Small-Angle Scattering and Acoustic Emission During the Deformation. II. Evaluation of the Interface Strength

机译:通过同时测量变形过程中的超小角散射和声发射研究聚合物复合材料的破坏机理。二。界面强度评估

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摘要

The failure mechanism in polystyrene (PS) filled with glass beads was investigated with the methods of ultra-small-angle X-ray scattering (USAXS) and acoustic emission (AE) analysis simultaneously. The interface in the composites was tailored using carboxyl-terminated PS (PS-COOH). Monolayers of PS-COOH were prepared on the glass surface in a wide range of grafting densities, from single chains to a polymer brush. The layers were characterized by ellipsometry, scanning probe microscopy, and the wetting method. The morphology of the layers is in good agreement with the theoretical predictions. USAXS experiments identify submicrovoids (SMVs) at the interface in the composites even before a tensile deformation. The uniaxial loading of the specimens is followed by a debonding (dewetting) process that is identified by simultaneous increase of integral scattering intensity and AE signals. The stress of debonding is proportional to the grafting density of PS-COOH. The amplitude of the AE signals decreases as the grafting density increases. Sizes of SMVs do not depend on the draw ratio, but increase as the interface strength increases. From the analysis of all experimental data, a failure mechanism of the composites is suggested. It is proposed that the debonding stress characterizes the interface strength, while the AE amplitude gives information about the location of microdefects.
机译:同时利用超小角度X射线散射(USAXS)和声发射(AE)分析方法研究了填充玻璃珠的聚苯乙烯(PS)的破坏机理。复合材料中的界面是使用羧基封端的PS(PS-COOH)定制的。从单链到聚合物刷,在玻璃表面上以各种接枝密度制备了PS-COOH单层。通过椭圆光度法,扫描探针显微镜法和润湿方法对这些层进行表征。层的形态与理论预测非常吻合。 USAXS实验甚至在拉伸变形之前就在复合材料的界面处发现了亚微孔(SMV)。样品的单轴加载之后是去粘(去湿)过程,该过程通过同时增加积分散射强度和AE信号来识别。剥离应力与PS-COOH的接枝密度成正比。 AE信号的幅度随着接枝密度的增加而减小。 SMV的大小不取决于拉伸比,而是随着界面强度的增加而增加。通过对所有实验数据的分析,提出了复合材料的破坏机理。有人提出,脱粘应力表征了界面强度,而AE振幅给出了有关微缺陷位置的信息。

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