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TEM in situ study of isothermally induced cracking in the near-interface region of an SiCw/6061AI composite

机译:SiCw / 6061AI复合材料近界面区域等温诱发裂纹的TEM原位研究

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摘要

Most of the metal matrix composites (MMCs) are designed to be used as elevated temperature struc-tural materials. Hence, their elevated temperature strength, thermal cycling and isothermal exposure resistance are studied extensively [1-9], with par-ticular focus on the continuous fibre reinforced MMCs. The results show that the degradation of continuous fibre reinforced MMCs exposed to elev-ated temperature is attributed to damage at the fibre-matrix interface and/or the fibre itself [1-4]. For whisker or participate reinforced MMCs, such as silicon carbide whisker reinforced aluminium (SiCw/Al) composites, the data of isothermal ex-posure is limited [2, 9]; to date, it can be concluded that the strength of the composites decrease after they are isothermally exposed.
机译:大多数金属基复合材料(MMC)被设计用作高温结构材料。因此,对它们的高温强度,热循环和耐等温暴露性进行了广泛的研究[1-9],尤其着眼于连续纤维增强的MMC。结果表明,暴露于高温下的连续纤维增强MMC的降解归因于纤维-基质界面和/或纤维本身的损坏[1-4]。对于晶须或参与增强的MMC,例如碳化硅晶须增强铝(SiCw / Al)复合材料,等温暴露量的数据是有限的[2,9]。迄今为止,可以得出结论,等温暴露后,复合材料的强度降低。

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