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Growth of BN film on Si substrate by carbothermic reduction of boric acid in nitrogen glow discharge plasma

机译:氮辉光放电等离子体中硼酸的碳热还原法在Si衬底上生长BN膜

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摘要

The quest for boron nitride is driven by the fact that its properties are similar and, in some cases, superior to those of diamond [1]. In the cubic phase (c-BN) it is characterized by low density, extreme hardness, large thermal conductivity, wide band gap, trans-parency over a large region of the electromagnetic spectrum and high electrical resistivity. Cubic boron nitride, as a substitute for diamond, has potential applications in hard coatings, heat sinks for elec-tronic devices, optical coatings etc. It is also specu-lated that c-BN may be better suited than diamond for electronic device applications because c-BN can be easily doped as n- and p-type, whereas ?-type diamond has proven difficulty to grow [2]. The importance of growing c-BN thin films on substrates like Si is prompted by the demand from the electronic industry. Although a wide variety of chemical vapour deposition (CVD) [3-5], physical vapour deposition [6, 7], ion assisted techniques [8], ion implantation, RF sputtering, magnetron sputter-ing [9] and electron cyclotron resonance plasma enhanced CVD techniques [10] have been reported to grow BN films, most of the results mention the growth of a mixture of hexogonal and cubic phase. So far, ion beam techniques have the edge over other methods in depositing c-BN films [2,11-13] but the processes are quite expensive. Cheaper methods such as plasma-assisted CVD, tried by a few researchers, [14-16], do not give satisfactory results in respect of adhesion and single phase growth. In our search for alternate methods of BN film growth, a new technique of carbothermic reduction of boric acid in an RF glow discharge plasma (nitrogen) has been developed and the structural characterization of the films by X-ray diffraction (XRD) and scanning electron microscope (SEM) are reported here.
机译:对氮化硼的追求是由于其性质相似且在某些情况下优于金刚石[1]。在立方相(c-BN)中,其特点是密度低,极限硬度大,热导率高,带隙宽,电磁频谱大区域的透明性和高电阻率。立方氮化硼可替代金刚石,在硬质涂层,电子设备的散热器,光学涂层等方面具有潜在的应用。还推测c-BN可能比金刚石更适合用于电子设备,因为c-BN可以很容易地掺杂为n型和p型,而事实证明α型金刚石很难生长[2]。电子工业的需求促使在诸如Si的衬底上生长c-BN薄膜的重要性。尽管有各种各样的化学气相沉积(CVD)[3-5],物理气相沉积[6,7],离子辅助技术[8],离子注入,RF溅射,磁控溅射[9]和电子回旋共振等离子体增强CVD技术[10]已经报道可以生长BN膜,大多数结果都提到了六方相和立方相混合物的生长。到目前为止,离子束技术在沉积c-BN膜方面比其他方法更具优势[2,11-13],但该过程非常昂贵。一些研究者尝试过的便宜的方法,例如等离子体辅助CVD [14-16],在附着力和单相生长方面没有得到令人满意的结果。在寻找BN膜生长的替代方法时,已经开发了碳热还原RF辉光放电等离子体(氮)中硼酸的新技术,并通过X射线衍射(XRD)和扫描电子对膜进行结构表征显微镜(SEM)在这里报道。

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