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首页> 外文期刊>Journal of Materials Science >THERMOELECTRIC PROPERTIES OF FINE-GRAINED SINTERED (BI2TE3)(25)-(SB2TE3)(75) P-TYPE SOLID SOLUTION
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THERMOELECTRIC PROPERTIES OF FINE-GRAINED SINTERED (BI2TE3)(25)-(SB2TE3)(75) P-TYPE SOLID SOLUTION

机译:细粒烧结(BI2TE3)(25)-(SB2TE3)(75)P型固体溶液的热电性质

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P-type semiconductor alloy compacts of the composition (Bi2Te3)(25) - (Sb2Te3)(75) with grain size (L) in the range 30 > L > 20 mu m, 20 > L > 15 mu m, 15 > L > 10 mu m, 10 > L > 5 and L < 5 mu m were prepared by cold press at a pressure of 77 x 10(7) Nm(-2). The samples were sintered at 673 K. Measurements of the, Seebeck coefficient, electrical resistivity and thermal conductivity were carried out. The experimental results show that the Seebeck coefficient increases, but not much from the single crystal. The electrical resistivity increases in particular for the size L < 5 mu m with a reduction in grain size. The total thermal conductivity seriously decreases as grain size decreases. It is concluded that the figure of merit of the compacted alloy would be significantly improved through the use of fine-grained powders of size 30-10 mu m. [References: 20]
机译:组成(Bi2Te3)(25)-(Sb2Te3)(75)的P型半导体合金压块,其晶粒尺寸(L)在30> L> 20微米,20> L> 15微米,15> L通过在77 x 10(7)Nm(-2)的压力下冷压制备> 10μm,10> L> 5和L <5μm。将样品在673 K下烧结。进行塞贝克系数,电阻率和热导率的测量。实验结果表明,塞贝克系数增加,但单晶的增加不大。特别是对于尺寸L <5μm的电阻率随着晶粒尺寸的减小而增加。总热导率随着晶粒尺寸的减小而严重降低。结论是,通过使用尺寸为30-10μm的细粉,可以显着改善压实合金的品质因数。 [参考:20]

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