...
首页> 外文期刊>Journal of Materials Science >P-type semiconducting Cu2O-NiO thin films prepared by magnetron sputtering
【24h】

P-type semiconducting Cu2O-NiO thin films prepared by magnetron sputtering

机译:磁控溅射制备P型半导体Cu2O-NiO薄膜

获取原文
获取原文并翻译 | 示例

摘要

P-type semiconducting thin films consisting of a new multicomponent oxide composed of Cu2O and NiO were deposited on glass substrates by r.f. magnetron sputtering using Cu2O-NiO mixed powder targets. The multicomponent oxide thin films deposited in an Ar atmosphere with a Ni content (Ni/(Cu + Ni) atomic ratio) in the range from 0 to 100 at.% were found to be p-type semiconductors. As the Ni content was increased in the range from 0 to about 30 at.%, the energy bandgap of the resulting films gradually increased as well as the obtained resistivity increased from 70 to 4 x 10(4) Omega cm, a consequence of decreases in both the Hall mobility and the hole concentration. The films prepared with a Ni content of about 30-50 at.% exhibited a relatively constant resistivity and energy bandgap. The resistivity and the energy bandgap of films prepared with a Ni content above about 60 at.% considerably increased as the Ni content was increased. Furthermore, a pn thin-film heterojunction prepared by depositing undoped n-ZnO and p-multicomponent oxide (Ni content of 50 at.%) thin films exhibited a rectifying I-V characteristic.
机译:通过射频法在玻璃基板上沉积由新型的由Cu2O和NiO构成的多组分氧化物组成的P型半导体薄膜。使用Cu2O-NiO混合粉末靶材进行磁控溅射。发现在Ar气氛中沉积的Ni含量(Ni /(Cu + Ni)原子比)为0至100原子%的多组分氧化物薄膜是p型半导体。随着Ni含量从0到大约30 at。%的范围内增加,所得膜的能带隙逐渐增加,而获得的电阻率也从70 x 4(10)Ωcm增加,这是降低的结果。在霍尔迁移率和空穴浓度方面。 Ni含量为约30-50at。%的薄膜表现出相对恒定的电阻率和能带隙。当Ni含量增加时,Ni含量高于约60原子%的薄膜的电阻率和能带隙显着增加。此外,通过沉积未掺杂的n-ZnO和p-多组分氧化物(Ni含量为50 at。%)薄膜制备的pn薄膜异质结表现出I-V整流特性。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号