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首页> 外文期刊>Journal of Materials Science >CHARACTERISTICS OF SOL-GEL DERIVED PZT THIN FILMS WITH LEAD OXIDE COVER LAYERS AND LEAD TITANATE INTERLAYERS
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CHARACTERISTICS OF SOL-GEL DERIVED PZT THIN FILMS WITH LEAD OXIDE COVER LAYERS AND LEAD TITANATE INTERLAYERS

机译:氧化铅覆盖层和钛酸酯中间层的溶胶-凝胶衍生的PZT薄膜的特性

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The set-gel derived PbZr0.53Ti0.47O3 (PZT) films were fabricated on the bare Pt/Ti/SiO2/Si substrates or the same substrates coated by the PbTiO3 (PT) interlayers. The post-deposition annealing temperature and time were optimized when the PbO cover layers and PbO vapour-containing atmosphere were compared with each other and adopted as the method to diminish the lead-loss problem during the high-temperature post-deposition annealing. The X-ray diffraction patterns, microstructures, and electrical properties such as relative permittivity, epsilon(r), remanent polarization, P-r, and coercive electrical field, E(c), were investigated in relation to the annealing conditions. The PZT films deposited on the bare Pt/Ti/SiO2/Si substrates under the PbO vapour-containing atmosphere showed better electrical properties. This indicates that the PbO vapour-containing atmosphere may be the better method of lead-loss-prevention to process the lead-containing films rather than the PbO cover layer method. The electrical characteristics of the PZT films, epsilon(r) = 1150, a dissipation factor of 0.039, P-r = 26 mu C cm(-2), and E(c) = 40.5 kV cm(-1), were measured at 1 kHz. When PZT films were deposited on substrates coated by the PT layers, PZT-PT films with single perovskite phase were derived by post-deposition annealing at 500 degrees C for 1 h. However, the relative electrical properties are very poor, i.e. E(r) = 160, P-r = 2.0 mu C cm(-2) and E(c) = 75 kV cm(-1). The optimum combination for preparing PZT-PT films is a 40 nm PbTiO3 interlayer and annealing conditions of 6 h at 550 degrees C in a PbO vapour-containing atmosphere; the derived films exhibit electrical properties of E(r) = 885, P-r = 21.5 mu C cm(-2) and E(c) = 64 kV cm(-1). The combination of inserting a PT interlayer and annealing in a PbO vapour-containing atmosphere can prevent the formation of electrical short paths. In this case, nearly pin-hole-free PZT films can be grown on the PT (interlayer)/Pt/Ti/SiO2/Si substrates. It is believed that it is possible to prepare the PZT films with nano-scale uniformity, reproducible quality, which may be worth considering for commercial applications. [References: 24]
机译:凝固凝胶衍生的PbZr0.53Ti0.47O3(PZT)膜是在裸露的Pt / Ti / SiO2 / Si基板或涂有PbTiO3(PT)中间层的相同基板上制造的。当比较PbO覆盖层和含PbO的气氛时,可以优化沉积后退火的温度和时间,并将其作为减少高温沉积后退火过程中铅损失问题的方法。与退火条件有关,研究了X射线衍射图,微观结构和电性能,例如相对介电常数ε,剩余极化强度P-r和矫顽电场E(c)。在含PbO的气氛下沉积在裸露的Pt / Ti / SiO2 / Si衬底上的PZT膜显示出更好的电性能。这表明,与PbO覆盖层法相比,含PbO蒸气的气氛可能是防止含铅薄膜加工的更好的防止铅损的方法。 PZT薄膜的电学特性在1时测量,ε= 1150,耗散系数为0.039,Pr = 26μC cm(-2),E(c)= 40.5 kV cm(-1)。千赫。当将PZT膜沉积在被PT层覆盖的基材上时,通过在500摄氏度下进行1h的后退火处理,可以得到具有单一钙钛矿相的PZT-PT膜。但是,相对电性能非常差,即E(r)= 160,P-r = 2.0μC cm(-2)和E(c)= 75 kV cm(-1)。制备PZT-PT薄膜的最佳组合是40 nm PbTiO3中间层和在含PbO蒸气的气氛中在550摄氏度下退火6小时的条件。衍生的薄膜具有E(r)= 885,P-r = 21.5μC cm(-2)和E(c)= 64 kV cm(-1)的电性能。在含有PbO的气氛中插入PT中间层并进行退火可以防止电短路的形成。在这种情况下,几乎无针孔的PZT膜可以在PT(中间层)/ Pt / Ti / SiO2 / Si衬底上生长。据信可以制备具有纳米级均匀性,可再现质量的PZT膜,这对于商业应用可能是值得考虑的。 [参考:24]

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