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首页> 外文期刊>Journal of Materials Science >Morphological features of interfacial intermetallics and interfacial reaction rate in Al-11Si-2.5Cu-(0.15/0.60)Fe cast alloy/die steel couples
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Morphological features of interfacial intermetallics and interfacial reaction rate in Al-11Si-2.5Cu-(0.15/0.60)Fe cast alloy/die steel couples

机译:Al-11Si-2.5Cu-(0.15 / 0.60)Fe铸造合金/模具钢对的界面金属间形态特征和界面反应速率

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摘要

Soldering reactions are commonly observed during high pressure die casting of aluminium alloys, and involve the formation and growth of interfacial intermetallics between the die and the cast alloy. It is generally believed that close to 1% Fe is necessary in the aluminium alloy to reduce soldering. However, the role of iron in the interfacial reaction has not been studied in detail. In this investigation, reaction couples were formed between H13 tool steel substrates and an Al-11Si-2.5Cu melt containing either 0.15 or 0.60% Fe. Examination revealed distinctly different intermetallic layer morphology. The overall growth and chemistry of the reaction layer and the reaction rate measured by the consumption of the substrate were compared for the two alloy melts. It was demonstrated that a higher iron content reduces the rate of interfacial reaction, consistent with an observed thicker compact ( solid) intermetallic layer. Hence, the difference in reaction rate can be explained by a significant reduction in the diffusion flux due to a thicker compact layer. Finally, the mechanism of the growth of a thicker compact layer in the higher iron melt is proposed, based on the phase relations and diffusion both within and near the interfacial reaction zone. (C) 2004 Kluwer Academic Publishers. [References: 27]
机译:焊接反应通常在铝合金的高压压铸过程中观察到,并且涉及在压模和铸造合金之间形成和生长界面金属间化合物。通常认为,铝合金中需要接近1%的铁以减少焊接。但是,尚未详细研究铁在界面反应中的作用。在这项研究中,在H13工具钢基材和含有0.15或0.60%Fe的Al-11Si-2.5Cu熔体之间形成了反应偶。检验显示出明显不同的金属间层形态。比较了两种合金熔体的反应层的总体生长和化学性质以及由基材消耗量测得的反应速率。结果表明,较高的铁含量会降低界面反应的速率,这与观察到的较厚的致密(固态)金属间层一致。因此,反应速率的差异可以通过由于较厚的致密层而导致的扩散通量的显着降低来解释。最后,基于界面反应区域内和界面附近的相关系和扩散,提出了高铁熔体中较厚致密层的生长机理。 (C)2004 Kluwer学术出版社。 [参考:27]

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